MiP technology is gaining momentum, with ongoing developments from companies like Sinyopto Optoelectronics and Lihua.

With the advancement of Mini/Micro LED technology and the growing trend toward small-pitch product applications, LED packaging technology has entered a new era of diversified development, encompassing COB, MiP, SMD, and COG solutions.

Among these, MiP technology is a chip-level packaging technique. Specifically, it involves transferring a massive number of Micro LED chips from an epitaxial wafer onto a carrier substrate, followed by direct encapsulation and dicing—after which the chips undergo inspection and light-mixing processes. A key feature of this technology is its ability to leverage SMD manufacturing processes, ensuring seamless compatibility with existing production equipment and helping manufacturers reduce their reliance on heavy capital investments.

Therefore, many companies in the industry are also viewing MiP as a key future technology for LED packaging and are continuously stepping up their efforts to accelerate the development of MiP technology. Recently, the LED sector has been buzzing with frequent updates on the latest advancements in MiP technology.

Sinyopto Photonics and Aimap Forge Strategic Partnership with MiP

On February 14, Hubei Sinyopto Co., Ltd. (hereinafter referred to as "Sinyopto Optoelectronics") and Hubei Aimap Optoelectronic Technology Co., Ltd. (hereinafter referred to as "Aimap") officially signed a strategic cooperation agreement on MiP (Micro LED in Package). At the heart of this collaboration is the integration of both companies' technological expertise and resource advantages, aiming to accelerate the industrialization of Micro LED display technology.

Image source: Sinyopto Optoelectronics

It is reported that Sinyopto Optoelectronics and Aimapp complement each other's strengths in areas such as Micro LED chip technology, chip-level packaging, mass transfer technology, and panel-level packaging. The two companies will jointly focus on streamlining the entire industry chain—from chips and packaging to applications—enhancing product competitiveness, and accelerating the widespread adoption of Micro LED display technology.

Through this collaboration, the two parties will combine MiP packaging and panel technologies, fully leveraging their respective strengths to significantly enhance display product performance and accelerate the industrialization process. The partnership will primarily focus on the Micro LED ultra-narrow-pitch display market—applications such as high-end TVs, all-in-one devices, and premium cinema systems—while simultaneously expanding into high-end market segments like AR/VR and automotive displays.

Sinyopto Photonics revealed that the two companies are currently collaborating to develop the next-generation revolutionary product, AMiP, which integrates AM Micro ICs and Micro LEDs into a single package. The launch of AMiP will help upgrade LED displays from passive to active driving, significantly enhancing display quality.

Liplyu unveils LEKIN-SiMiP, the industry's first silicon-based GaN single-chip full-color Micro LED chip.

On February 17, Suzhou LEKIN Semiconductor Co., Ltd. (LEKIN) announced the launch of the industry’s first silicon-based GaN single-chip integrated full-color Micro-LED chip—LEKIN-SiMiP—and has begun collaborating with display customers such as HKC to validate its application in micro-pitch LED large-screen direct-display solutions. This technology overcomes the challenges associated with mass transfer, significantly boosting direct-through yield rates.
 

Image source: LEKIN Lìxū

It is reported that Lixuan Semiconductor has independently developed a single-chip full-color SiMiP display chip technology, built upon its proprietary silicon-based GaN-based high-efficiency Micro-LED technology.

According to reports, SiMiP is a next-generation MiP technology that employs a single-chip integration solution, eliminating the need for complex mass transfer and repair processes—resulting in a significant improvement in throughput yield. Additionally, by adopting an innovative technological approach, it reduces reliance on conventional methods.

The intricate processes in the art form avoid toxic materials, offering greater environmental benefits; moreover, the red, green, and blue primary-color pixels exhibit remarkable consistency in terms of emission wavelength, operating voltage, and light distribution, fundamentally resolving the color-shift issues inherent in conventional approaches.

ISE 2025: Never-ending stream of new MiP technology products

At the recently concluded European Audiovisual Technology and Systems Integration Expo (ISE 2025) in early February, MiP-related technologies and new products made frequent appearances, becoming one of the event's major highlights. For instance, Allwinner Electronics unveiled its MiP series of commercial display screens, which, thanks to MiP technology, achieve a contrast ratio of up to 10,000:1.

Guoxing Optoelectronics showcased its MiP series products designed for ultra-high-definition displays, including display components such as MiP-CIMD12, MiP-AIMD19, and MiP-AIMD26, as well as display panel modules like MiP0606, MiP0404, and MiP0303.

CrystalTech Optoelectronics unveils its new outdoor MiP1010 product, featuring high thrust, wide viewing angles, an inverted-chip design, and versatile common-anode/common-cathode compatibility—among other standout qualities. The dynamic presence at the exhibition also reflects industry players' confidence and forward-looking attitude toward the future development of MiP technology.

Business leaders step in to support, as MiP production capacity steadily expands.

On the production side, MiP capacity is also steadily increasing. Last November, Leyard announced that the company’s fully in-house-developed, high-end MiP production line had officially entered mass production, with yield rates for the high-end MiP products manufactured on this line exceeding 95%.

It is reported that Leyard's first-phase advanced MiP production line can achieve a capacity of up to 1,200KK per month, while the second-phase production line will expand capacity to 2,400KK per month. This expansion will further accelerate the cost reduction and efficiency improvement of Micro LED display products, delivering Micro LED solutions with superior value and enhanced visual performance to the market—and significantly boosting demand in the ultra-small-pitch, high-definition display segment below P1.0.

As a leading enterprise in the LED display industry, Leyard has significantly ramped up production of MiP technology, undoubtedly providing a powerful boost to its development.

In addition, more companies are now joining the race to ramp up MiP production capacity. For instance, last December, Ample Optoelectronics, a wholly-owned subsidiary of Sanan Optoelectronics, announced that it has successfully developed and begun mass-producing Micro LED devices such as MiP0404 and MiP0202, as well as Micro LED display panels like MiP0.78 and MiP0.9. The company currently boasts a monthly MiP (Micro LED in PKG) production capacity of 2000kk, with plans to expand this capacity to 5000kk per month by the end of 2025.

Summary

MiP packaging technology is rapidly gaining momentum, and in the near future, MiP and COB technologies will gradually dominate application areas across various pitch ranges, driving growth in the LED display market.

TrendForce predicts that as COB and MiP technologies continue to mature, the cost of ultra-small-pitch LED displays will decline, enabling the LED display market to maintain rapid growth. Specifically, the market for LED displays with pitches ≤ P2.5 is expected to reach US$7.389 billion by 2027, with a compound annual growth rate of 12%, while the market for displays with pitches ≤ P1.0 is projected to hit US$1.145 billion in 2027, boasting an impressive CAGR of 34%. (Reported by LEDinside's Irving)