Core Technologies
R&D, manufacturing, and sales of fifth-generation display devices: Mini & Micro LED

Core Technologies

MiP Technology

(Micro LED)

MiP Technology, or Micro LED in Package, leverages mass transfer technology and substrate-free true Micro-level chips to not only improve production efficiency but also significantly reduce costs.

Mass Transfer Technolog

The mass transfer solution is highly efficient. The Stamp mass transfer method achieves speeds 70 times faster than traditional die bonding machines, precisely positioning Micro LEDs.

This high transfer efficiency greatly boosts production output and reduces manufacturing costs.

Note: Traditional transfer: 60K/h | Mass transfer: ≥ 4KK/h

Hubei Sinyopto

Stamp Mass Transfer Illustration

Micro-level chip + substrate-free structure

Hubei Sinyopto

Traditional Upright LED

+ Vertical R

Flip-chip

Mini LED

Micro LED

Advantages of MiP Technology

Wide Viewing Angle

True Micro LED chips, substrate-free,
with highly uniform chip placement, deliver consistent light output.

Hubei Sinyopto
Hubei Sinyopto

MiP Devices – Substrate-Free for More Uniform Light Output

MiP Panels – No Color Shift at Wide Viewing Angles

Excellent Color Temperature Symmetry:

Small chips, more densely arranged, better color mixing, eliminating large-angle color shift.

Hubei Sinyopto
Hubei Sinyopto

Distance between Mini LED chips > 200 μm

(Actual Photo)

Distance between Micro LED chips < 25 μm

(Actual Photo)

Higher Contrast

Smaller emitting area, higher black ratio, allowing panels to use higher transparency (>70%) encapsulation.

Hubei Sinyopto
Hubei Sinyopto

Mini COB

MiP Micro LED

Note: Mini LED black ratio — 80–90%;
MiP black ratio — greater than 96% (0202).