Core Technologies
R&D, manufacturing, and sales of fifth-generation display devices: Mini & Micro LED

Core Technologies

RFN Technology

(Robust Flat No-leads Package)

Inspired by advanced IC packaging, RFN technology differs from traditional upright LED devices with bent leads by hiding the leads beneath the
device and thinning the cup body. This design maximizes the lead area while greatly improving lead flatness and enhancing impact resistance.

RFN devices use high-Tg BT/FR4-like materials, unlike conventional TOP devices that use thermoplastic PPA.
This material has a lower coefficient of thermal expansion, higher reliability, and greater stability.

Function of RFN

(1) By increasing the contact area between the leads and the substrate, the driving force is improved by 100% compared to conventional products,
effectively preventing LED detachment caused by impacts during assembly and disassembly in the professional rental market.

Hubei Sinyopto

(2) The bottom leads use an etching process, making the base flatter than traditional devices, providing more consistent left-right viewing angles,
better color temperature uniformity, and higher symmetry, significantly reducing screen uniformity issues.

Hubei Sinyopto

(3) RFN products feature a shorter, slimmer cup body, offering wider left-right viewing angles and an expanded overall viewing angle.

Hubei Sinyopto