Core Technologies
R&D, manufacturing, and sales of fifth-generation display devices: Mini & Micro LED

Core Technologies

Black Underfill Technology

(Black Bottom Fill Technology)

Black Underfill fills non-emitting areas inside the LED or module with black ink,
effectively enhancing contrast and color uniformity, addressing the common challenge of balancing brightness and contrast.

Application of Black Underfill Technology

Applied to Devices

Black ink is filled at the bottom of gaps between chips,
covering non-emitting areas and effectively masking metal pads.

Hubei Sinyopto

Applied to Modules

Black ink is applied in the narrow gaps between LEDs to improve contrast and enhance the bonding strength between the GOB process and the module base.

Hubei Sinyopto

Applied to Panels (Mini/Micro LED Panels)

Addresses intermittent color differences between substrates, improving ink uniformity and panel contrast.

Hubei Sinyopto

Function of Black Underfill

Provides excellent uniformity, achieving optimal contrast at the same
brightness and higher brightness at the same contrast.

Delivers extreme contrast of 100,000:1 or higher, accurately reproducing rich and subtle black levels,
giving images enhanced realism and depth.

Hubei Sinyopto